|
Adhesive
|
Service Temperature
|
Cure Temperature
|
Wide Area Bonding
|
Volatile Content
|
Product Form
|
|
XLC
|
500-550°F
|
620°F
|
YES
|
8%
|
SF, P
|
|
XHB
|
600°F
|
650-700°F
|
YES
|
14%
|
SF,P
|
|
N18G
|
550°F
|
350-600°F
|
NO
|
20%
|
SF
|
|
DS6
|
600°F
|
700°F
|
YES
|
8%
|
SF, P
|
SF = supported film adhesive, P = paste adhesive |
|
High Temperature Adhesives
P2SI's newly developed adhesives and sealants technology (Liquimide™) solves a decades old problem with previous state of the art high temperature polyimide adhesives: volatiles. Liquimide™ enables addition cure, low to zero volatile adhesives with good tack and flow characteristics (similar to liquid epoxy adhesives) but with use temperatures in excess of 600°F (316°C). High temperature products include supported film and paste adhesives, all based on P2SI's novel Liquimide™ technology.
Key Features
- Glass transition temperatures of 600-800°F (316-427°C)
- No known carcinogenic components (non-MDA)
- Paste and supported film product forms
- Suitable for wide area structural and honeycomb bonding
- Vacuum bag only, compression molding/no vacuum, and autoclave processing
- Adhesive continuous use temperature of 600°F (316°C)
|
|