P2SI® 350-X20: A toughened 350°F cure aerospace grade epoxy adhesive with excellent hot-wet properties, controlled flow, and large processing window.
P2SI® DS6N: A high temperature, low volatile polyimide adhesive suitable for structural wide area bonding, gap filling, and for bonding complex geometries. Available as a paste or supported film adhesive.
P2SI® DS77: A low volatile, toughened, high temperature adhesive with continuous service temperatures up to 600°F with vacuum bag only cure, compression molding, or autoclave processing as low as 620°F. Suitable for structural bonding of complex shapes and gap filling. Available as a paste or supported film adhesive.
